^^^ I like what this dudes saying
Sent from my DROID2 using Tapatalk
Nerdgasm! Man I bet that PC smokes!!
Haha, thank you both! Big Ry, I simply try to be as "logical" or (can't think of the right word) while remaining unbiased, or as unbiased as possible, when comparing things like this. It's a result of my education being so heavily-focused on science (chemical engineering and psychopharmacology), but it has trickled into my "normal" life as well
I do have to say, though, at this point we are all pretty much simply "armchair benchmarking", as none of us has two completely-virgin phones (one Rezound/RAZR and one Nexus) in our hands with everything 100% "factory", to set side-by-side and have them both run through the same exact set of benchmarks at the same exact time (to rule out variables such as ambient temperature, humidity, elevation, tidal pattern, planetary alignment, and all of the other variables people will no doubt bring up :wink: ).
THEN, and ONLY THEN, will we as a community be able to say which is the "better phone" out of the box. Actually, no, we'd only be able to say which is the FASTER phone out-of-the-box, not which is "better", as "good/better/best" are highly subjective.
Yeah, tgyberg, it is pretty quick... although I am hitting fantastic benchmark scores and I am able to get consistently-high FPS in almost all games at highest-settings (2560x1600 resolution), the new SandyBridge-E processors are making my Phenom II six-core look like a toy :'(
I've been building up the water-cooling setup for ~2 years, so I've had more than enough time to "fiddle-with", "tinker", and "tweak" it to my satisfaction, and it is pretty much exactly how I want it; best part being that it is completely transferable to a new rig, the only components that would require replacement would be the CPU/Chipset/Video-Card/Possibly-RAM heatsinks, although the RAM will likely come with me to my next rig, as will the SSD's and HDD's. But, until AMD releases a Bulldozer or Piledriver CPU that is truly "next generation", I'll simply continue extracting as much performance out of the Phenom II as I can!
*WARNING: UBER-NERD CONTENT BELOW! READ AT YOUR OWN RISK!!!
Currently, I'm using a Danger Den external enclosure for my main H2O components, which allows me to run three separate "circuits" at once, instead of using the same liquid to try and cool: two overclocked GPU's, an overclocked CPU, overclocked RAM, overclocked chipset, and a case full of storage drives! I just recently moved some things around in the case and re-routed some tubing to try and lower my temps another 2-3*C, so currently I've got it set up as follows...
*(FYI: all radiators have both push and pull fans, all push-fans use shrouds to eliminate no-flow zones)*
*Circuit 1: 5/8" Tubing from D.D. Housing to dual-layer pure-copper CPU heatsink, 1/2" tubing from CPU to pure-copper Chipset heatsink on both NB/SB, then through an inline Swiftech dual-circuit pump and another 3" to the inline 120mm radiator (with 2x120mm fans 1push/1pull; mounted on 1 of 3 top case exhaust slots), from there it splits into a "Y" tube going from 1x1/2" to 2x1/4" and runs first to both OCZ Vertex 3 Max IOPS 240GB SSD's and then runs through two short 1" brass connectors to both Intel SSD's, with the two exits merging (via 2x1/4" to 1x1/2" Y-Tube) into a single 1/2" tubing which is then routed back to the D.D. external enclosure after passing-through the inline dual-circuit pump once again.
*Circuit 2: 1/2" Tubing from D.D. Housing to Radeon 6970(#1, fully-enclosed in pure-copper max-surface-area heatsink), entering from top and exiting from bottom, it then goes through a side-mounted 120mm inline radiator (push/pull fans) and through a Swiftech dual-circuit inline pump, from which it heads to 1/2 of the system RAM and cools it via pure-copper heatsinks (sleeve-style) that are mounted on the RAM, and after it leaves both DIMMs, it heads back to the D.D. case
*Circuit 3: 1/2" Tubing - Identical to Circuit 2 except that it cools Radeon6970(#2), goes through its own 120mm inline radiator, shares the Swiftech pump, and cools the remaining two RAM DIMMs before heading back
(Circuits 2/3 are so much smaller because the GPUs' heatsinks take up a LOT of surface area, and dissipate A LOT of heat; the CPU circuit, while generating a lot of heat, is able to dissipate it more quickly due to the higher pressure system.)
Inside the (customized) Danger Den enclosure, there is the following:
- Three Primary water pumps:
- 1x Innovatek Eheim HPPS Ultra Water Pump with Infinitely-Variable Speed Adjustment (for Circuit 1)
- 2x Swiftech MCP655 Silent Water Pumps with Variable Speed Adjustment (Circuits 2/3)
- 3x modular 360mm triple-core/copper-core Radiators with 36 fins-per-inch (407x146x68mm) - approximately 1250W heat dissipation per radiator
- Each Radiator has 3x120mm Push Fans with a 45mm triple-fan shroud and 3x120mm Pull Fans with a 25mm shroud (Fans are 120x38mm, 4000rpm max and 184cfm at that speed! very loud, but sound insulated)
- ThermalTake 2L Refrigerated Reservoir with Triple-Layer Insulation; I added another layer of exterior Insulation (I have the liquid exiting the reservoir at 19.7*F with my current liquid-mix: 1 bottle Redline Water-Wetter, 3x 700mL bottle Koolance Ultra-Performance Non-Conductive Coolant, and about 500mL distilled H2O - freezing point is now at like -45*F)
- Insulation: Gold Foil (left over from my BMW; used to wrap certain parts in both the enclosure and in the PC case, such as refrigerator coil area), R8 1/8"-thick Polyboard lining interior of case, R12 Heat Wrap around Reservoir, and various other bits and pieces of various insulating materials (i.e. Pumps are a combo of silicone, aluminum reflective barrier, and wrap).
- All hosing inside the housing and between Housing and PC Case is shrouded by 5/8"-or-1/2"-interior-diameter 4-layer Silicone Hosing (1" outer-diameter, left-over from upgrading my BMW's cooling system); not very flexible, but very insulating... to bend the silicone in a circle without kinking it, the diameter is about 2 1/2 feet.
- All hosing inside the PC Case has stainless-steel braiding over it to keep it in place
- All connections (between tubing and barbs) are secured with two stainless-steel clamps (one clockwise and one counterclockwise)
- The entire case has been as sound-insulated as possible, seeing as it's only a few feet away from the PC Case itself (Dyna-Mat Pro, Expanding Foam, etc); the case has also had extra ventilation holes drilled in where necessary, and there is metal piping to direct cold air to both the radiators and the refrigerator coils, with the coils having their own "exhaust duct" leading to the top of the case; the radiators have deflectors that direct exhaust air upwards and away from everything else
Inside PC Case:
- 1/2"ID Clear Tubing (100% UV Resistant)
- Stainless Steel Braided Wrapping
- 99.98% Pure-Copper Heatsinks/Water-Blocks with Nickel e-Plated Coating (on air-exposed areas) for CPU/RAM-DIMMs/Chipset(NB/SB/MOSFET)/SSDs/Video-Cards
- 3x Swiftech Dual-Circuit Mini Ultra-Silent Water Pumps (inline)
- 3x 120mm Single-/Dual-Circuit dual-density Radiators with Copper Cores/Fins (INLINE)
- 6x 120x38mm 3500rpm 138cfm Fans (3x push and 3x pull)
- Case Fans to keep airflow solid for the rest of the components - 2x front-bottom intake, 3x top exhaust, 2x rear exhaust (all are 180-240mm in size, relatively-low RPM)
- All case wires and everything are completely tucked away; not a single wire is visible; the tubing is kept as minimal and to-the-sides (of the case) as possible for airflow
Everything is controlled by: one 5.25"bay controller (5" color LED-LCD display, case/radiator-fan controls, pump controls; Shows up to 32 different things, including: current flow speed, pump speed, temperatures, relative efficiency (enter temp vs exit temp), fan RPM, etc)
There are 12 temperature sensors that I installed, plus 5 integrated into the case/MoBo, so I can see everything from the temperature of the liquid leaving the reservoir, coming into the reservoir, before and after each radiator, etc. Quite nice. I also can see the CPU, GPU, RAM, and SSD/HDD temps.
All heatsinks/water-blocks are attached via Arctic Silver 5 Thermal Compound, which was done after sanding/polishing the surfaces to a mirror-finish (increases surface area by decreasing air bubbles).
Keep in mind, this has taken over 2 years and ~$750+ to put together, and I've had a friend do a lot of the work (he is much more savvy with this stuff than I) but it's a constant work in progress. It started out as a simple CPU-cooler, and now it's big enough it needs its own case! lol
I'm currently thinking of adding a fourth circuit, to take stress off of the CPU circuit, and I have an extra 360mm radiator, 120mm radiator, and about 20 different fans, but I don't have the pumps or the sensors, so we'll see... Depends on how much harder I push the CPU.
Blah, sorry for the long post. Once I get going, it's hard to stop me :O